Furukawa Denshi’s sintering technology is capable of manufacturing the world’s largest class (φ550mm) of aluminum nitride components. In the future, we will accommodate even larger wafer diameters.
Furukawa Denshi offers materials as well. Please feel free to contact us with any inquiry about aluminum nitride.

Aluminum nitride substrates achieve both high heat radiation and electrical insulating properties. They are used as heat radiation substrates for 5G-era power semiconductors and optical communication lasers, radiating heat while insulating.

With outstanding filling properties in resin and ability to significantly increase thermal conductivity, filler consisting of aluminum nitride sintered into spherical shape is used in heat radiation sheets and other applications. Aluminum nitride fillers contribute to improved heat radiation, a key issue as electronic components become increasingly downsized and integrated.